Abstract. This paper presents a innovative method of image processing utilizing both the phase and amplitude characteristics of the output signal of an ECT probe. A unique probe has been designed and fabricated for the inspection of printed circuit boards ’ (PCB) structure.. The probe is composed of a meander-exciting coil and of a solenoid pick-up coil. The probe can detect various defects in PCB’s conductors such as cracks, partial declines, and chipped defects. The signal’s amplitude and phase, obtained as resultant data from the inspection, deliver information about defects, the geometry of conductors and the positions of soldering points. The strong relationship between the amplitude and the phase allows a new approach to signal analys...
The development of Eddy Current non-destructive techniques and instruments is moving towards new cha...
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (...
In this work, we present an inspection method for power and ground (P&G) layers of printed circuit b...
The detection of imperfections (such as disconnections, chipping cracks, nonuniformity in thickness ...
This paper reports an analysis of errors formed during an inspection of printed circuit boards (PCB)...
ABSTRACT: This paper presents an eddy current testing (ECT) probe for printed circuit boards (PCB) i...
This paper presents a novel eddy-current testing (ECT) sensor for the inspection of printed circuit ...
This paper presents a wavelet-based image processing technique, which analyzes eddy-current testing ...
This paper presents a theory of the superposition of two signal components formed during the inspect...
This paper presents simulated amplitude and phase characteristics obtained during the inspection of ...
金沢大学環日本海域環境研究センター生体機能計測研究部門A new application of eddy current testing techniques for investigating tr...
This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of us...
International audienceWith the density increase of today's printed circuit board assemblies (PCBA), ...
This paper presents an image processing method utilizing the wavelet transform (WT) for the inspecti...
This paper describes bare printed circuit board (PCB) inspection based on eddy-current testing (ECT)...
The development of Eddy Current non-destructive techniques and instruments is moving towards new cha...
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (...
In this work, we present an inspection method for power and ground (P&G) layers of printed circuit b...
The detection of imperfections (such as disconnections, chipping cracks, nonuniformity in thickness ...
This paper reports an analysis of errors formed during an inspection of printed circuit boards (PCB)...
ABSTRACT: This paper presents an eddy current testing (ECT) probe for printed circuit boards (PCB) i...
This paper presents a novel eddy-current testing (ECT) sensor for the inspection of printed circuit ...
This paper presents a wavelet-based image processing technique, which analyzes eddy-current testing ...
This paper presents a theory of the superposition of two signal components formed during the inspect...
This paper presents simulated amplitude and phase characteristics obtained during the inspection of ...
金沢大学環日本海域環境研究センター生体機能計測研究部門A new application of eddy current testing techniques for investigating tr...
This paper shows a possibility to visualize signal propagation in electronic circuits. Instead of us...
International audienceWith the density increase of today's printed circuit board assemblies (PCBA), ...
This paper presents an image processing method utilizing the wavelet transform (WT) for the inspecti...
This paper describes bare printed circuit board (PCB) inspection based on eddy-current testing (ECT)...
The development of Eddy Current non-destructive techniques and instruments is moving towards new cha...
High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (...
In this work, we present an inspection method for power and ground (P&G) layers of printed circuit b...